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Shenzhen Hengxunda Circuit Technology Co.,LTD
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Double sided pcb soldering electronics pcb components assembly mother board pcb reflow double sided pcb

Shenzhen Hengxunda Circuit Technology Co.,LTD
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Double sided pcb soldering electronics pcb components assembly mother board pcb reflow double sided pcb

MOQ : 1pcs

Price : USD 0.1-5/pcs

Payment Terms : T/T, Western Union,paypal

Brand Name : hengsheng

Model Number : HSG6046

Certification : UL,TS16949,ROHS, ISO9001

Place of Origin : china

Supply Ability : 100000pcs per month

Delivery Time : 7-10working days

Packaging Details : 25kgs/carton, vacuumed packing

Base material : FR-4

Board thickness : 1.6mm

Surface finishing : Immerson Gold

Min. line spacing : 4mil

Min. line width : 4mil

Min. hole size : 0.25mm

Copper thickness : H/Hoz

Test : E-test/Fixture text

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Process Capability And Checking Parameters(Hard Board)
NO ITEM Technical Capabilities
1 Layers 1-38L
2 Max.Board Size 1200*610mm
48"*24"
3 Finished Board Thickness 0.2mm--10.0mm
0.008"--0.4"
4 Finished Copper Thickness 17um-420um
0.5OZ--12OZ
5 Min.Trace Width/Space 0.075mm/0.065mm
0.003"/0.0026"
6 Min.Hole Size 0.15mm
0.006"
7 Hole Dim. Tolerance(PTH) ±0.05mm
±0.002"
8 Hole Dim.Tolerance(NPTH) ±0.05mm
±0.002"
9 Drill Location Tolerance ±0.05mm
±0.002"
10 V-Cut Degrees 20-90 ºC
20DEG-90DEG
11 Min.V-Cut PCB Thickness 0.4mm
0.016"
12 N/C Routing Tolerance ±0.1mm
±0.004"
13 Min.Blind/Buried Via 0.15mm
0.06"
14 Plug Hole Size 0.2mm--0.6mm
0.008"--0.024"
15 Min.BGA PAD 0.2mm
0.008"
16 Materials FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB
17 Surface Finish HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F
18 Warp & Twist ≤0.75%
19 Electrical Testing 50--300V
20 Solderability Testing 245±5ºC,3sec Wetting area least95%
21 Thermal Cycling Testing 288±5ºC,10sec,3cycles
22 Ionic Contamination Testing Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm
23 Soldmask Adhesion Testing 260ºC+/-5, 10S,3times


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