Home > Multilayer PCB >

pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design

Product Categories

Double Sided PCB [17]
Aluminum PCB [20]
Flexible FPC [9]
Main/Mother Board PCB [2]
PCB Assembly [9]
Multilayer PCB [37]
4 layer PCB [15]
6 layer PCB [10]
PCB Design [2]

Shenzhen Hengxunda Circuit Technology Co.,LTD

Contact Now

pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design

Name: pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design
Brand: hengsheng
Price: 0.1 USD

Buy cheap pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design product

Brand Name : hengsheng

Model Number : HS40152

Certification : UL,TS16949,ROHS, ISO9001

Place of Origin : china

MOQ : 1pcs

Price : USD 0.1-5/pcs

Payment Terms : T/T, Western Union,paypal

Supply Ability : 50000pcs/month

Delivery Time : 7-10work days

Packaging Details : 25kgs/carton, vacuumed packing

Material : FR-4

Board Thickness : 2.0mm

Base copper : 50um(1.5oz)

Min. line space : 0.15mm

Min. line width : 0.15mm

Min. hole size : 0.30mm

Surface : ENIG

Type : industrial control

Contact Now

Process Capability And Checking Parameters(Rigid Board)
NO	ITEM	Technical Capabilities
1	Layers	1-38L
2	Max.Board Size	1200*610mm
		48"*24"
3	Finished Board Thickness	0.2mm--10.0mm
		0.008"--0.4"
4	Finished Copper Thickness	17um-420um
		0.5OZ--12OZ
5	Min.Trace Width/Space	0.075mm/0.065mm
		0.003"/0.0026"
6	Min.Hole Size	0.15mm
		0.006"
7	Hole Dim. Tolerance(PTH)	±0.05mm
		±0.002"
8	Hole Dim.Tolerance(NPTH)	±0.05mm
		±0.002"
9	Drill Location Tolerance	±0.05mm
		±0.002"
10	V-Cut Degrees	20-90 ºC
		20DEG-90DEG
11	Min.V-Cut PCB Thickness	0.4mm
		0.016"
12	N/C Routing Tolerance	±0.1mm
		±0.004"
13	Min.Blind/Buried Via	0.15mm
		0.06"
14	Plug Hole Size	0.2mm--0.6mm
		0.008"--0.024"
15	Min.BGA PAD	0.2mm
		0.008"
16	Materials	FR4(TG130-TG170),Aluminium,Halogen-free,Rogers,ShengYi,KB

17	Surface Finish	HASL-LF,ENIG,ImAg,ImSn,OSP,Gold platting, ENIG+OSP,HAL+G/F

18	Warp & Twist	≤0.75%

19	Electrical Testing	50--300V

20	Solderability Testing	245±5ºC,3sec Wetting area least95%

21	Thermal Cycling Testing	288±5ºC,10sec,3cycles

22	Ionic Contamination Testing	Pb,Hg,Cd,Cr(VI),PBB,PBDE six items are less than 1000ppm

23	Soldmask Adhesion Testing	260ºC+/-5, 10S,3times

pcb manufacturing 10 layer with plug hole pcb FR4 tg170 material ENIG surface BGA multilayer circuit boards pcb design Images

Inquiry Cart 0

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	Shenzhen Hengxunda Circuit Technology Co.,LTD
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!